JPH0448640U - - Google Patents
Info
- Publication number
- JPH0448640U JPH0448640U JP9175590U JP9175590U JPH0448640U JP H0448640 U JPH0448640 U JP H0448640U JP 9175590 U JP9175590 U JP 9175590U JP 9175590 U JP9175590 U JP 9175590U JP H0448640 U JPH0448640 U JP H0448640U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- die
- package
- lead shaping
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007493 shaping process Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002699 waste material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175590U JPH0448640U (en]) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175590U JPH0448640U (en]) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448640U true JPH0448640U (en]) | 1992-04-24 |
Family
ID=31827666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9175590U Pending JPH0448640U (en]) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448640U (en]) |
-
1990
- 1990-08-31 JP JP9175590U patent/JPH0448640U/ja active Pending
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